Intelligent
Defect Analysis
SiGlaz’ Intelligent
Defect Analysis (IDATM) software
provides semiconductor fabs with an automatic
excursion monitoring capability that integrates
seamlessly into existing yield management
architecture to provide immediate value-added
functionality. IDA monitors inspection
results files (KLARF) in production and
automatically recognizes spatial defect
signatures resulting from equipment failure
and process excursions.
IDA is a Spatial Signature Analysis software,
and it may be integrated into the fabrication
process to identify concentrated defect
signatures (e.g., scratches or micro-scratches)
or to identify distributed defect signatures,
such a those resulting from the failure
of a process tool. The software integrates
into the fab’s data base management
and SPC system; it is compatible with
advanced Microsoft .NET framework and
XML format.
SiGlaz Software also provides engineering
resources to customize the software for
specific customer applications.
IDA
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